Layers count: 108L Board thickness: 8.6mm Min drilling hole dia: 0.50mm Aspect ratio: 17.2:1 Distance from hole to line: 10mil
Layers count: 30L Min drilling hole dia: 0.50mm Line Width/Space: 5/5mil Special Process: Press fit hole
Layers count: 20L Min drilling hole dia: 0.20mm Line Width/Space: 3/3mil Special Process: Back drilling, Via in PAD
Layers count: 16L Min drilling hole dia: 0.20mm Line Width/Space: 4/4mil Special Process: Back drilling, Via in PAD
Layers count: 4L Min drilling hole dia: 0.30mm Line Width/Space: 5/3.5mil
Large-scale capacity
Modular production
Flexible capacity
MP of PCB
Medium batch of PCB
Small batch of PCB
R&D sample of PCB
SMT manufacturing